KW

Kun-Chih Wang

UM United Microelectronics: 2 patents #26 of 270Top 10%
📍 Shanghai, TX: #1 of 11 inventorsTop 10%
Overall (2004): #53,684 of 270,089Top 20%
2
Patents 2004

Issued Patents 2004

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6710448 Bonding pad structure 2004-03-23
6707129 Fuse structure integrated wire bonding on the low k interconnect and method for making the same 2004-03-16