Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825064 | Multi-chip semiconductor package and fabrication method thereof | Shiann-Tsong Tsai, Yu-Ming Hsu, Kuen-Huang Chen, Wen-Sheng Su, Chin-Hsing Lin | 2004-11-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825064 | Multi-chip semiconductor package and fabrication method thereof | Shiann-Tsong Tsai, Yu-Ming Hsu, Kuen-Huang Chen, Wen-Sheng Su, Chin-Hsing Lin | 2004-11-30 |