Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6814919 | Sealing device and process for manufacturing the same | Hironori Minagawa | 2004-11-09 |
| 6740814 | Wiring connection method and wiring connection structure | Hiroshi Moriguchi | 2004-05-25 |
| 6738487 | Earphone | Koji Nageno, Hideki Seki, Naotaka Tsunoda | 2004-05-18 |
| 6708862 | Die bonding apparatus | Toshihiko Fujii, Shinichi Sugiura, Toshimasa Akamatsu, Katsufumi Morimune | 2004-03-23 |