YL

Yi-Ching Lin

📍 Taichung, CA: #14 of 43 inventorsTop 35%
Overall (2004): #83,996 of 270,089Top 35%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6693359 High density wire bonding pads for semiconductor package — 2004-02-17