Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6686665 | Solder pad structure for low temperature co-fired ceramic package and method for making the same | Guilian Gao, David J. Lewis | 2004-02-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6686665 | Solder pad structure for low temperature co-fired ceramic package and method for making the same | Guilian Gao, David J. Lewis | 2004-02-03 |