Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6784535 | Composite lid for land grid array (LGA) flip-chip package assembly | — | 2004-08-31 |
| 6734567 | Flip-chip device strengthened by substrate metal ring | Mohammad Yunus | 2004-05-11 |
| 6696644 | Polymer-embedded solder bumps for reliable plastic package attachment | Manjula Variyam | 2004-02-24 |