Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6747353 | Barrier layer for copper metallization in integrated circuit fabrication | Katsuhiro Aoki, Yukio Fukuda | 2004-06-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6747353 | Barrier layer for copper metallization in integrated circuit fabrication | Katsuhiro Aoki, Yukio Fukuda | 2004-06-08 |