Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6784022 | Method of dicing a semiconductor wafer and heat sink into individual semiconductor integrated circuits | Norito Umehara | 2004-08-31 |
| 6762506 | Assembly of semiconductor device and wiring substrate | Masako Watanabe | 2004-07-13 |
| 6713851 | Lead over chip semiconductor device including a heat sink for heat dissipation | Norito Umehara | 2004-03-30 |