Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6800555 | Wire bonding process for copper-metallized integrated circuits | Howard R. Test, Willmar Subido | 2004-10-05 |
| 6750134 | Variable cross-section plated mushroom with stud for bumping | Diane Arbuthnot | 2004-06-15 |