Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6717276 | Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assembly | Masood Murtuza | 2004-04-06 |
| 6707124 | HID land grid array packaged device having electrical and optical interconnects | Kurt Peter Wachtler, Larry J. Mowatt | 2004-03-16 |