Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6753616 | Flip chip semiconductor device in a molded chip scale package | — | 2004-06-22 |
| 6696757 | Contact structure for reliable metallic interconnection | Mohammad Yunus | 2004-02-24 |