YP

Yi-Ping Pan

SE Seh-America: 1 patents #4 of 22Top 20%
📍 Taipei, WA: #4 of 7 inventorsTop 60%
Overall (2004): #83,932 of 270,089Top 35%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6733368 Method for lapping a wafer Brazel G. Preece 2004-05-11