KL

Kuan-Min Lin

TSMC: 1 patents #234 of 898Top 30%
Overall (2004): #172,165 of 270,089Top 65%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6765228 Bonding pad with separate bonding and probing areas Jin-Ji Shen 2004-07-20