Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6709965 | Aluminum-copper bond pad design and method of fabrication | Kuo-Chou Chen | 2004-03-23 |
| 6677228 | Reinforced aluminum copper bonding pad | Yea-Zan Su, Cheng-Chung Huang, Wen-Tsan Chang | 2004-01-13 |