Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6759264 | Pressure type fingerprint sensor fabrication method | Ben Chang, Wallace Y. W. Cheng | 2004-07-06 |
| 6710461 | Wafer level packaging of micro electromechanical device | Hsien-Ming Wu, Ping Sun | 2004-03-23 |