Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6814893 | Conductive adhesive agent, packaging structure, and method for manufacturing the same structure | Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Tousaku Nishiyama | 2004-11-09 |
| 6756663 | Semiconductor device including wiring board with three dimensional wiring pattern | Tsukasa Shiraishi, Kazuyoshi Amami, Yoshihiro Bessho | 2004-06-29 |
| 6749774 | Conductive adhesive and connection structure using the same | Hiroaki Takezawa, Takashi Kitae, Yukihiro Ishimaru | 2004-06-15 |
| 6749889 | Method for producing mounting structure for an electronic component | Hiroaki Takezawa, Minehiro Itagaki, Yoshihiro Bessho, Kazuo Eda | 2004-06-15 |
| 6675474 | Electronic component mounted member and repair method thereof | Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Yasuhiro Suzuki | 2004-01-13 |