Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6805808 | Method for separating chips from diamond wafer | Noboru Gotou, Tomoki Uemura, Toshiaki Saka, Katsuhiro Itakura | 2004-10-19 |
| 6713941 | Surface acoustic wave element | Katsuhiro Itakura, Akihiro Hachigo, Hideaki Nakahata, Shinichi Shikata | 2004-03-30 |