Issued Patents 2004
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6797926 | Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus | Naoto Hosotani, Kazuki Fukada, Katsuhiko Watanabe | 2004-09-28 |
| 6772937 | Method and apparatus for applying viscous material | Toshinori Mimura, Hiroaki Onishi, Toshiaki Yamauchi, Jun Shirai, Yoshiyuki Nagai +1 more | 2004-08-10 |
| 6770320 | Apparatus and method for applying fluid | Hidenobu Nishikawa, Takashi Sonoda, Teruo Maruyama, Shuji Ono | 2004-08-03 |
| 6736291 | Viscous material application apparatus | Toshinori Mimura, Wataru Hirai, Hiroaki Onishi, Koichi Nagai | 2004-05-18 |
| 6708401 | Method of manufacturing article having electronic circuit | Hidenori Miyakawa, Yoshio Maruyama, Mikiya Nakata, Takashi Akiguchi, Yoshinori Wada +1 more | 2004-03-23 |
| 6704209 | Aggregate of electronic components and mounting method thereof | Minoru Yamamoto | 2004-03-09 |