BH

Byung Joon Han

AT Amkor Technology: 1 patents #32 of 77Top 45%
📍 Singapore, NJ: #3 of 5 inventorsTop 60%
Overall (2004): #251,355 of 270,089Top 95%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6803254 Wire bonding method for a semiconductor package Young-Kuk Park, Jae Dong Kim 2004-10-12