Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6793837 | Process for material-removing machining of both sides of semiconductor wafers | Guido Wenski, Thomas Altmann, Gerhard Heier, Wolfgang Winkler | 2004-09-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6793837 | Process for material-removing machining of both sides of semiconductor wafers | Guido Wenski, Thomas Altmann, Gerhard Heier, Wolfgang Winkler | 2004-09-21 |