Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6716676 | Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same | Eing-Chieh Chen, Cheng-Yuan Lai | 2004-04-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6716676 | Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same | Eing-Chieh Chen, Cheng-Yuan Lai | 2004-04-06 |