Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6744124 | Semiconductor die package including cup-shaped leadframe | Mike F. Chang, King Owyang, Yueh-Se Ho, Y. Mohammed Kasem, Lixiong Luo | 2004-06-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6744124 | Semiconductor die package including cup-shaped leadframe | Mike F. Chang, King Owyang, Yueh-Se Ho, Y. Mohammed Kasem, Lixiong Luo | 2004-06-01 |