Issued Patents 2004
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6808819 | Heat resistant resin composition and adhesive film | Nobuhiro Ichiroku | 2004-10-26 |
| 6806509 | Light-emitting semiconductor potting composition and light-emitting semiconductor device | Masachika Yoshino | 2004-10-19 |
| 6794058 | Flip-chip type semiconductor device | Tsuyoshi Honda, Tatsuya Kanamaru, Eiichi Asano | 2004-09-21 |
| 6783859 | Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device | Shoichi Osada, Shingo Ando, Hiroyuki Takenaka, Kazutoshi Tomiyoshi | 2004-08-31 |
| 6780674 | Liquid epoxy resin composition and semiconductor device | Kazuaki Sumita, Haruyoshi Kuwabara | 2004-08-24 |
| 6733902 | Liquid epoxy resin composition and semiconductor device | Kazuaki Sumita, Tatsuya Kanamaru | 2004-05-11 |
| 6723452 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Yasuo Kimura, Kazutoshi Tomiyoshi, Tarou Shimoda, Eiichi Asano, Takayuki Aoki | 2004-04-20 |
| 6709756 | Optical device-related adhesive and optical device | Haruyoshi Kuwabara, Miyuki Wakao | 2004-03-23 |
| 6709753 | Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith | Tsuyoshi Honda, Tatsuya Kanamaru | 2004-03-23 |
| 6680007 | Conductive resin compositions and electronic parts using the same | Tsuyoshi Honda | 2004-01-20 |