Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6784464 | Semiconductor laser device and wire bonding method capable of easily performing reliable wire bonding | Hideki Ichikawa, Mamoru Okanishi, Toshihiko Yoshida | 2004-08-31 |