Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6724072 | Lead frame, resin sealing mold and method for manufacturing a semiconductor device using the same | Isao Ochiai | 2004-04-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6724072 | Lead frame, resin sealing mold and method for manufacturing a semiconductor device using the same | Isao Ochiai | 2004-04-20 |