Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6812549 | Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument | Yohei Kurashima, Jun Amako | 2004-11-02 |
| 6781089 | Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic device | Jun Amako, Kenichi Honda | 2004-08-24 |
| 6775958 | Package sealing method, manufacturing method of electronic device modules, sealing apparatus, and packaged product | Jun Amako, Hideo Tanaya | 2004-08-17 |
| 6690032 | Electro-optical device and method of manufacture thereof, and electronic instrument | — | 2004-02-10 |
| 6677237 | Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them | Jun Amako, Shinichi Yotsuya, Katsuji Arakawa | 2004-01-13 |