Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6824037 | Bonding device | Kouji Seki, Toshihiko Higashino | 2004-11-30 |
| 6729528 | Recognition device, bonding device, and method of manufacturing a circuit device | Kouji Seki, Toshihiko Higashino | 2004-05-04 |
| 6715660 | Recognition device, bonding device, and method of manufacturing a circuit device | Kouji Seki, Toshihiko Higashino | 2004-04-06 |