Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6787448 | Methods for forming metal interconnections for semiconductor devices using a buffer layer on a trench sidewall | — | 2004-09-07 |
JC
Jin-Sung Chung
Overall (2004): #194,449 of 270,089Top 75%
1
Patents 2004