Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6803252 | Single and multiple layer packaging of high-speed/high-density ICs | Binneg Y. Lao, William W. Chen, David A. Rowe | 2004-10-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6803252 | Single and multiple layer packaging of high-speed/high-density ICs | Binneg Y. Lao, William W. Chen, David A. Rowe | 2004-10-12 |