Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6787393 | Semiconductor package including a double-faced semiconductor chip having integrated circuitry on both sides thereof and a method of fabricating the semiconductor package | Ho Jin | 2004-09-07 |
| 6780734 | Wafer table and semiconductor package manufacturing apparatus using the same | Jae Hong Kim | 2004-08-24 |