Issued Patents 2004
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6836009 | Packaged microelectronic components | Eng Meow Koon, Low Siu Waf, Chan Min Yu, Ser Bok Leng, Zhou Wei | 2004-12-28 |
| 6836008 | Semiconductor packages with leadframe grid arrays and components | Chan Min Yu, Ser Bok Leng, Low Siu Waf, Eng Meow Koon | 2004-12-28 |
| 6818977 | Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages | Boon Suan Jeung, Chua Swee Kwang, Low Siu Waf, Chan Min Yu, Neo Yong Loo | 2004-11-16 |
| 6790706 | Apparatus and method for leadless packaging of semiconductor devices | Boon Suan Jeung, Low Siu Waf | 2004-09-14 |
| 6787894 | Apparatus and method for leadless packaging of semiconductor devices | Boon Suan Jeung, Low Siu Waf | 2004-09-07 |
| 6750547 | Multi-substrate microelectronic packages and methods for manufacture | Boon Suan Jeung, Low Siu Waf | 2004-06-15 |
| 6747348 | Apparatus and method for leadless packaging of semiconductor devices | Boon Suan Jeung, Low Siu Waf | 2004-06-08 |
| 6743696 | Apparatus and method for leadless packaging of semiconductor devices | Boon Suan Jeung, Low Siu Waf | 2004-06-01 |
| 6727116 | Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods | Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Loo, Chua Swee Kwang | 2004-04-27 |