Issued Patents 2004
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835593 | Method for manufacturing semiconductor device | — | 2004-12-28 |
| 6818550 | Method of cutting a wafer into individual chips | — | 2004-11-16 |
| 6815832 | Semiconductor device having opposed and connected semiconductor chips with lateral deviation confirming electrodes | — | 2004-11-09 |
| 6815829 | Semiconductor device with compact package | — | 2004-11-09 |
| 6782615 | Method of surface-mounting electronic components | Tsunemori Yamaguchi | 2004-08-31 |
| 6781247 | Semiconductor device | — | 2004-08-24 |
| 6777787 | Semiconductor device with warp preventing board joined thereto | — | 2004-08-17 |
| 6734556 | Semiconductor device with chip-on-chip construction joined via a low-melting point metal layer | — | 2004-05-11 |
| 6727582 | Semiconductor device | — | 2004-04-27 |
| 6724084 | Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device | Junichi Hikita, Goro Nakatani, Nobuhisa Kumamoto, Katsumi Sameshima, Shigeyuki Ueda | 2004-04-20 |
| 6717274 | Semiconductor device having a warp preventing sheet | — | 2004-04-06 |
| 6710431 | Semiconductor device and lead frame used therefor | — | 2004-03-23 |
| 6700189 | Resin sealed semiconductor device | — | 2004-03-02 |
| 6696347 | Production process for semiconductor device | Junichi Hikita, Shigeyuki Ueda | 2004-02-24 |