YL

Yung Piu Lau

QL Qpl Limited: 1 patents #1 of 2Top 50%
Overall (2004): #80,068 of 270,089Top 30%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6822319 Leadframe for enhanced downbond registration during automatic wire bond process Mohamed Lebbai Moosa Naina 2004-11-23