Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6808798 | Heat conductive resin substrate and semiconductor package | — | 2004-10-26 |
| 6794035 | Graphitized carbon fiber powder and thermally conductive composition | Naoyuki Shimoyama, Shinya Tateda | 2004-09-21 |
| 6761842 | Heat conductive mold and manufacturing method thereof | Shinya Tateda, Tsunehisa Kimura, Masahumi Yamato | 2004-07-13 |
| 6730731 | Thermally conductive polymer composition and thermally conductive molded article | Natsuko Ishihara, Naoyuki Shimoyama, Shinya Tateda | 2004-05-04 |