Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6822170 | Embedding resin and wiring substrate using the same | Toshifumi Kojima, Kazushige Ohbayashi, Hisahito Kashima | 2004-11-23 |
| 6770965 | Wiring substrate using embedding resin | Toshifumi Kojima, Kazushige Ohbayashi, Hisahito Kashima | 2004-08-03 |
| 6740411 | Embedding resin, wiring substrate using same and process for producing wiring substrate using same | Toshifumi Kojima, Kazushige Obayashi | 2004-05-25 |
| 6680123 | Embedding resin | Toshifumi Kojima, Kazushige Obayashi, Hisahito Kashima | 2004-01-20 |