Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6767484 | Transfer molding method for manufacturing semiconductor devices | Hiroyuki Nishi | 2004-07-27 |
| 6756690 | Molding die set and semiconductor device fabricated using the same | Shin Kurosawa | 2004-06-29 |