Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6780502 | Insulating resin composition and laminate obtained therefrom | Shinji Inaba, Koji Nakamura, Koichi Fujishiro | 2004-08-24 |
| 6780549 | Photo-or heat-curable resin composition and multilayer printed wiring board | Masahiko Takeuchi, Hironobu Kawasato | 2004-08-24 |
| 6770421 | Photo- or heat-curable resin composition and multilayer printed wiring board | Masahiko Takeuchi, Hironobu Kawasato | 2004-08-03 |