Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6787901 | Stacked dies utilizing cross connection bonding wire | Fifin Irzhann | 2004-09-07 |
| 6762495 | Area array package with non-electrically connected solder balls | Ryan David Lane, Tiona Marburger, Tom Gregorich | 2004-07-13 |
| 6680219 | Method and apparatus for die stacking | Fifin Irzhann | 2004-01-20 |