Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6750132 | Flip chip package, circuit board thereof and packaging method thereof | Kenji Morimoto | 2004-06-15 |
| 6740183 | Method of producing ceramic multi-layered substrate | Shigetoshi Segawa, Yasuyuki Baba, Osamu Shiraishi, Masao Konishi | 2004-05-25 |