Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6767761 | Method of manufacturing a flip-chip semiconductor device with a stress-absorbing layer made of thermosetting resin | — | 2004-07-27 |
| 6734566 | Recyclable flip-chip semiconductor device | — | 2004-05-11 |
| 6723627 | Method for manufacturing semiconductor devices | Syuuichi Kariyazaki | 2004-04-20 |
| 6696317 | Method of manufacturing a flip-chip semiconductor device with a stress-absorbing layer made of thermosetting resin | — | 2004-02-24 |
| 6696764 | Flip chip type semiconductor device and method of manufacturing the same | — | 2004-02-24 |