Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6800815 | Materials and structure for a high reliability bga connection between LTCC and PB boards | Michael Ehlert | 2004-10-05 |
| 6770513 | Thermally enhanced flip chip packaging arrangement | Seshadri Vikram | 2004-08-03 |