Issued Patents 2004
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6823582 | Apparatus and method for force mounting semiconductor packages to printed circuit boards | Joseph O. Smith | 2004-11-30 |
| 6812125 | Substrate for semiconductor packaging | — | 2004-11-02 |
| 6740961 | Lead frame design for chip scale package | — | 2004-05-25 |
| 6710246 | Apparatus and method of manufacturing a stackable package for a semiconductor device | Joseph O. Smith | 2004-03-23 |
| 6689640 | Chip scale pin array | — | 2004-02-10 |
| 6683368 | Lead frame design for chip scale package | — | 2004-01-27 |