Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835580 | Direct chip attach structure and method | Kok Yang LAU, Beng L. Lim, Guan Keng Quah | 2004-12-28 |
| 6833290 | Structure and method of forming a multiple leadframe semiconductor device | Stephen St. Germain | 2004-12-21 |
| 6747341 | Integrated circuit and laminated leadframe package | Stephen St. Germain | 2004-06-08 |
| 6713317 | Semiconductor device and laminated leadframe package | Stephen St. Germain | 2004-03-30 |
| 6677672 | Structure and method of forming a multiple leadframe semiconductor device | Stephen St. Germain | 2004-01-13 |