Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6699789 | Metallization process to reduce stress between Al-Cu layer and titanium nitride layer | Chung Yan Cheng, Ying-Yan Huang, Jason C. S. Chu | 2004-03-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6699789 | Metallization process to reduce stress between Al-Cu layer and titanium nitride layer | Chung Yan Cheng, Ying-Yan Huang, Jason C. S. Chu | 2004-03-02 |