Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835297 | High current density electrolytic decomposition process for copper | Toshiko Yokota, Susumu Takahashi, Yoshiaki Kinoshita | 2004-12-28 |
| 6777108 | Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil | Shin-ichi Obata | 2004-08-17 |