Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6791167 | Resin-molded device and manufacturing apparatus thereof | Kenichi Hayashi, Hisashi Kawafuji, Mitsugu Tajiri | 2004-09-14 |
| 6753596 | Resin-sealed semiconductor device | Dai Nakajima, Kiyoshi Ishida | 2004-06-22 |