Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6836004 | Lead frame, and method for manufacturing semiconductor device and method for inspecting electrical properties of small device using the lead frame | Naoyuki Shinonaga, Shinji Semba | 2004-12-28 |
| 6836007 | Semiconductor package including stacked semiconductor chips | Jun Shibata | 2004-12-28 |
| 6798056 | Semiconductor module having an upper layer semiconductor package overlying a lower layer semiconductor package | Tetsuya Matsuura, Yasushi Kasatani | 2004-09-28 |
| 6737733 | Sealed semiconductor device and lead frame used for the same | Kazuyuki Misumi, Yoshihiro Hirata | 2004-05-18 |