HW

Haruo Wakayama

MC Mitsubishi Diamond Industrial Co.: 1 patents #1 of 2Top 50%
Overall (2004): #212,927 of 270,089Top 80%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6796212 Scribing method for brittle materials, a cutter wheel used therefor and an apparatus provided therewith Kazuya Maekawa 2004-09-28