Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825553 | Multichip wafer level packages and computing systems incorporating same | Swee Kwang Chua, Siu Waf Low, Yong Poo Chia, Meow Koon Eng, Yong Loo Neo +2 more | 2004-11-30 |
| 6710454 | Adhesive layer for an electronic apparatus having multiple semiconductor devices | — | 2004-03-23 |