Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6833623 | Enhanced barrier liner formation for via | — | 2004-12-21 |
| 6828233 | Enhanced barrier liner formation for vias | — | 2004-12-07 |
| 6800180 | Resputtering to achieve better step coverage | — | 2004-10-05 |
| 6690094 | High aspect ratio metallization structures | Randle D. Burton | 2004-02-10 |